Supramolecular transparent plastic engineering via covalent-and-supramolecular polymerization
文献类型: 外文期刊
作者: Zhang, Yunfei 1 ; Cai, Changyong 2 ; Guo, Zhiyuan 3 ; Li, Xing 4 ; Zhao, Gai 3 ; Dong, Shengyi 1 ;
作者机构: 1.Hunan Univ, Coll Chem & Chem Engn, Changsha 410082, Hunan, Peoples R China
2.Chinese Acad Agr Sci, Inst Bast Fiber Crops, Changsha 410205, Hunan, Peoples R China
3.Nanjing Univ Aeronaut & Astronaut, State Key Lab Mech & Control Mech Struct, Nanjing 210016, Peoples R China
4.Hainan Univ, Sch Chem & Chem Engn, Haikou 570228, Peoples R China
期刊名称:MATERIALS HORIZONS ( 影响因子:10.7; 五年影响因子:12.1 )
ISSN: 2051-6347
年卷期: 2025 年 12 卷 7 期
页码:
收录情况: SCI
摘要: Supramolecular glass and plastic are a new generation of artificial transparent materials that exhibit excellent optical behavior and processability. However, owing to inherent deficiencies in their mechanical toughness and long-term stability, supramolecular materials lack the potential for functionalization and application. Inspired by the toughening phenomena in biological systems, a synergistic covalent-and-supramolecular polymerization strategy was applied to construct plastic-like supramolecular materials with high transmittance via the solvent-free one-pot amidation of thioctic acid and (poly)amines. Covalent amide linkers, dynamic disulfide bonds, and hydrogen bonds significantly enhance the mechanical toughness and hardness of supramolecular plastic. Greatly benefitting from covalent-and-supramolecular polymerization, not only does the supramolecular plastic exhibit a high mechanical strength of 45.51 MPa and a rigidity of 74.0 HD, but it is also highly resistant to mechanical impact (34.47 kJ m-2). Experimental and theoretical investigations demonstrated that polymeric structures connected via amide units are responsible for the tough mechanical properties, whereas the dynamic and reversible bonding/debonding of disulfide and hydrogen bonds favor energy dissipation, which together convert supramolecular transparent plastic into a rigid and tough material.
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